M1AFS250-QNG180



The product is a Fusion Field Programmable Gate Array (FPGA) Integrated Circuit (IC), specifically the 65-36864 model in a 180-WFQFN package with dual rows and an exposed pad.

Product Specifications:

Base Product Number
M1AFS250
ECCN
3A991D
HTSUS
8542.39.0001
Manufacturer
Microsemi Corporation
Moisture Sensitivity Level (MSL)
3 (168 Hours)
Other Names
M1AFS250-QNG180 | 150-M1AFS250-QNG180
Package
Tray
Series
Fusion
Standard Package
184