TI60F225C3



The device is a Titanium Field Programmable Gate Array (FPGA) Integrated Circuit, with the part number 163 and catalog number 2726298. It was manufactured in 2016 and features a Ball Grid Array (BGA) package type of 225 pins.

Product Specifications:

Manufacturer
Efinix Inc
Moisture Sensitivity Level (MSL)
3 (168 Hours)
Package
Tray
RoHS Status
ROHS3 Compliant
Series
Titanium
Standard Package
168