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| MRC | Name | Details |
|---|---|---|
| AGXW | PHYSICAL FORM | PASTE |
| AKKF | QUANTITY WITHIN EACH UNIT PACKAGE | 100.000 GRAMS |
| ALXZ | SPECIFIC USAGE DESIGN | FOR BONDING SEMICONDUCTORS AND OTHER ELECTRONIC COMPONENTS TO CHASSIS OR HEAT SINKS |
| CBBL | FEATURES PROVIDED | SEPARATE CATALYST |
| FEAT | SPECIAL FEATURES | THERMALLY CONDUCTIVE |
| HUES | COLOR | GREEN |
| MATT | MATERIAL | PLASTIC EPOXY |
| SUPP | SUPPLEMENTARY FEATURES | 100 GRAM KIT |