A1460A-1PQG208C



The field-programmable gate array (FPGA) integrated circuit (IC) ACT 3 is designated as part number 167, packaged in the 208-bump ball grid array (BGA) format known as BFQFP.

Product Specifications:

Base Product Number
A1460
ECCN
3A991D
HTSUS
8542.39.0001
Manufacturer
Microsemi Corporation
Moisture Sensitivity Level (MSL)
3 (168 Hours)
Other Names
150-A1460A-1PQG208C | A1460A-1PQG208C
Package
Tray
REACH Status
REACH Unaffected
Series
ACT 3
Standard Package
24

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