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A high-performance integrated circuit, specifically a Fusion Field Programmable Gate Array (FPGA), is available in package type 256-LBGA with the part number 119. The component has a large ball grid array (L-BGA) package size of 276480 pins.
Product Specifications:
Base Product Number
AFS1500
ECCN
3A991D
HTSUS
8542.39.0001
Manufacturer
Microchip Technology
Moisture Sensitivity Level (MSL)
3 (168 Hours)
Package
Tray
REACH Status
REACH Unaffected
RoHS Status
RoHS non-compliant
Series
Fusion
Standard Package
90