AGL600V2-FG144T



The IGLOO Field Programmable Gate Array (FPGA) Integrated Circuit features a 97 million transistor count, with a die size of 110592 square micrometers and a package size of 13824 square millimeters. It has a 144-Leg Ball Grid Array (BGA) package type.

Product Specifications:

Base Product Number
AGL600
ECCN
3A991D
HTSUS
8542.39.0001
Manufacturer
Microsemi Corporation
Moisture Sensitivity Level (MSL)
3 (168 Hours)
Other Names
150-AGL600V2-FG144T | AGL600V2-FG144T
Package
Tray
REACH Status
REACH Unaffected
RoHS Status
RoHS non-compliant
Series
IGLOO
Standard Package
10,080

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