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The IGLOO Plus Field Programmable Gate Array (FPGA) IC is identified by the part number 212. It features a package type of 36864 and has a total of 3120 pins. The IGLOO Plus FPGA IC uses a ball grid array (BGA) packaging style referred to as CSBGA.
Product Specifications:
HTSUS
8542.39.0001
ECCN
3A991D
Standard Package
184
Manufacturer
Microchip Technology
Base Product Number
AGLP125
RoHS Status
RoHS non-compliant
Moisture Sensitivity Level (MSL)
3 (168 Hours)
REACH Status
REACH Unaffected
Package
Tray
Series
IGLOO PLUS