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The FPGA chip model is identified as a Fusion Field Programmable Gate Array with part number 223, and it has a large package size of 276480. This specific device features a 484-ball Grid Array (BGA) packaging type.
Product Specifications:
Base Product Number
M1AFS1500
ECCN
3A991D
HTSUS
8542.39.0001
Manufacturer
Microchip Technology
Moisture Sensitivity Level (MSL)
3 (168 Hours)
Package
Tray
REACH Status
REACH Unaffected
RoHS Status
ROHS3 Compliant
Series
Fusion
Standard Package
60