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Shop By BrandsM7AFS600-1PQG208
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The device is a Fusion Field Programmable Gate Array (FPGA), packaged in an Integrated Circuit (IC) form, with the specific part number being 95. It has a pin count of 208 and comes in a Ball Grid Array (BGA) package known as BFQFP.
Product Specifications:
Series
Fusion
HTSUS
8542.39.0001
ECCN
3A991D
Other Names
150-M7AFS600-1PQG208 | M7AFS600-1PQG208
Manufacturer
Microsemi Corporation
Moisture Sensitivity Level (MSL)
3 (168 Hours)
Standard Package
24
REACH Status
REACH Unaffected
Package
Tray
Base Product Number
M7AFS600