M7AFS600-2PQG208



The device is a Fusion Field Programmable Gate Array (FPGA) Integrated Circuit, packaged in the 208-Ball Fine Pitch Quad Flat Package (BFQFP).

Product Specifications:

Base Product Number
M7AFS600
ECCN
3A991D
HTSUS
8542.39.0001
Manufacturer
Microsemi Corporation
Moisture Sensitivity Level (MSL)
3 (168 Hours)
Other Names
M7AFS600-2PQG208 | 150-M7AFS600-2PQG208
Package
Tray
REACH Status
REACH Unaffected
Series
Fusion
Standard Package
24

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