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The device in question is a Titanium Field Programmable Gate Array (FPGA) Integrated Circuit with the part number 34 2726298. It features a 64-ball Ball Grid Array (BGA) package as well as a Wafer Level Chip Scale Package (WLCSP). The year of production is listed as 2016.
Product Specifications:
ECCN
EAR99
HTSUS
8542.39.0001
Manufacturer
Efinix Inc
Moisture Sensitivity Level (MSL)
1 (Unlimited)
Other Names
2134-TI60W64C3TR | 2134-TI60W64C3DKR | 2134-TI60W64C3CT
Package
Tape & Reel (TR)Cut Tape (CT)Digi-Reel
RoHS Status
ROHS3 Compliant
Series
Titanium
Standard Package
2,000