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The device is a Fusion Field Programmable Gate Array (FPGA), packaged in an Integrated Circuit (IC) format with part number 119. It has a die size of 276480 and a lead count of 256, contained within a Land Grid Array (L-BGA).
Product Specifications:
Base Product Number
U1AFS1500
ECCN
3A991D
HTSUS
8542.39.0001
Manufacturer
Microchip Technology
Moisture Sensitivity Level (MSL)
3 (168 Hours)
Package
Tray
REACH Status
REACH Unaffected
RoHS Status
RoHS non-compliant
Series
FusionÂ
Standard Package
90